Electronic module
AssigneeShindengen Electric Manufacturing Co., Ltd.
InventorsKosuke Ikeda, Osamu Matsuzaki
Life of this patent
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Abstract
An electronic module has a first substrate 11, a first electronic element 13 provided on one side of the first substrate 11, a first connection body 60 provided on one side of the first electronic element 13, a second electronic element 23 provided on one side of the first connection body 60, a second substrate 21 provided on one side of the second electronic element 23, and an abutment body 250 that abuts on a face on one side of the second electronic element 23 and is capable of imparting a force toward one side with respect to the second substrate 21.
Claims5
An electronic module comprising:
- a first substrate;
- a first conductor layer provided on one side of the first substrate;
- a first electronic element provided on one side of the first conductor layer;
- a first connection body, being different from adhesive, provided on one side of the first electronic element and having a first head part and a first pillar part extending from the first head part to the other side;
- a second electronic element provided on one side of the first connection body;
- a second substrate provided on one side of the second electronic element and being a flat plate larger than the first electronic element and the second electronic element in plane;
- a second conductor layer provided on the other side of the second substrate;
- and
- an abutment body that has an abutment proximal end part that abuts on a face on one side of the second electronic element, a second-substrate-side abutment part that extends from the abutment proximal end part toward one side and abuts directly on the second conductor layer or the second substrate, and a first-substrate-side abutment part that extends from the second-substrate-side abutment part to the other side and abuts on the first conductor layer or the first substrate, and is capable of imparting a force toward one side with respect to the second substrate,
- wherein the abutment body electrically connects the second electronic element and a terminal part which is connectable to an external device.
An electronic module comprising:
- a first substrate that is a metal substrate;
- a first electronic element provided on one side of the first substrate;
- a first connection body, being different from adhesive, provided on one side of the first electronic element and having a first head part and a first pillar part extending from the first head part to the other side;
- a second electronic element provided on one side of the first connection body;
- a second substrate provided on one side of the second electronic element, and being a metal substrate and being a metal substrate being a flat plate larger than the first electronic element and the second electronic element in plane;
- and
- an abutment body that has an abutment proximal end part that abuts on a face on one side of the second electronic element, a second-substrate-side abutment part that extends from the abutment proximal end part toward one side and abuts directly on the second substrate, and a first-substrate-side abutment part that extends from the second-substrate-side abutment part to the other side and abuts on the first substrate, and is capable of imparting a force toward one side with respect to the second substrate,
- wherein the abutment body electrically connects the second electronic element and a terminal part which is connectable to an external device.
Dependencies are inferred from the claim text.