US 11,309,269 B2Granted

Method for producing a solder bump on a substrate surface

AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives

InventorsArnaud Garnier, Laetitia Castagne, Anthony De Luca, Daniel Mermin, Pierre Montmeat

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Abstract

A serigraphy method for producing a soulder bump on the front surface of a substrate includes: forming a film on the front surface, forming an opening in the film, filling the opening with a souldering material, and removing the film. Forming a film on the front surface is preceded by the formation of an intermediate layer between the film and the front surface, the intermediate layer being adapted to exhibit a force of adherence at one and/or the other interface formed with the first front surface and the film lower than the force of adherence that can be formed between the film and the first front surface.

Claims18

Dependent claims

A method for producing by screen printing at least one solder bump on a first front face of a first substrate, the method comprising the following steps:

a) a step of forming a film covering the first front face;
b) a step of forming at least one opening in the film, said at least one opening being for delimiting the at least one solder bump;
c) a step of filling, by screen printing, the at least one opening with a solder material so as to form the at least one solder bump;
d) a step of removing the film;
and
a step preceding step a) includes forming an intermediate layer sandwiched between the film and the first front face,
wherein the intermediate layer has an adhesion energy, at either interface formed with the first front face and the film, which is lower than the adhesion energy of an interface likely to be formed between the film and the first front face.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 16/977,987Filed 1 Mar 2019
Priority: FR 18520699 Mar 2018
Published: US 2021/0074659 A111 Mar 2021
Granted: 19 Apr 2022
Term ends: Not estimatedThe source records don’t support an estimate.

Classification18 codes

H10W 72/012
Manufacture or treatment: of bump connectors, dummy bumps or thermal bumps
H10P 76/202
Of masks comprising organic materials: for lift-off processes
H10W 72/01204
Of bump connectors, dummy bumps or thermal bumps: using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
H10W 72/01223
Using local deposition: in liquid form, e.g. by dispensing droplets or by screen printing

Family

US 2021/0074659 A1Pre-grant publication · published 11 Mar 2021
US 11,309,269 B2This patent

From the US filing history. Foreign family members aren’t listed.

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