Method of designing a layout, method of making a semiconductor structure and semiconductor structure

A method of making a semiconductor structure comprising:

• forming an interconnect structure over a substrate;
• forming a first contact pad over a circuit region of the interconnect structure;
• forming a second contact pad over a non-circuit region of the interconnect structure;
• and
• depositing a first buffer layer over the first contact pad and second contact pad, wherein an edge of the first buffer layer is over the second contact pad, and the first buffer layer exposes an edge of the second contact pad farthest from the first contact pad.

A semiconductor structure comprising:

• an interconnect structure;
• a first contact pad over a circuit region of the interconnect structure;
• a seal ring in the interconnect structure, wherein the seal ring is electrically isolated from the first contact pad;
• a second contact pad over the seal ring;
• and
• a first buffer layer over the first contact pad and second contact pad, wherein the first buffer layer is partially over the second contact pad, and an edge of the second contact pad farthest from the first contact pad extends beyond the first buffer layer.