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US 11,309,251 B2Granted
Selective metallization of integrated circuit packages
AssigneeAdTech Ceramics Company
InventorsAaron Fitzsimmons, William Minehan
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Abstract
The disclosed technology generally relates to metallization of substrates, and more particularly to selective metallization of ceramic substrates. A method of selectively metallizing a substrate includes forming a base metal layer comprising a refractory metal on a substrate, forming a base nickel (Ni) layer over the base metal layer by a vapor phase process, forming a palladium (Pd) layer on the base Ni layer by electroless plating, and forming a gold (Au) layer on the Pd layer.
Claims63
A method of metallizing a ceramic package configured to house an electronic component, the method comprising:
- providing a ceramic substrate having a via formed therethrough;
- forming a base metal layer comprising a refractory metal on the ceramic substrate, the base metal layer having upper and lower portions formed on opposing major surfaces of the ceramic substrate and further having a via portion extending through the via and connecting the upper and lower portions, wherein the upper, lower and via portions form a continuous base metal layer having the same composition;
- forming a base nickel (Ni) layer formed on the base metal layer, wherein the base Ni layer is free of phosphorus (P) and boron (B) or has concentrations of P and B each less than 0.01% on the basis of a weight of the base Ni layer;
- selectively forming a nickel (Ni) layer over the base metal layer by electroless plating;
- forming a palladium (Pd) layer on the Ni layer by electroless plating;
- and
- forming a gold (Au) layer on the Pd layer,
- wherein one or more of the base Ni layer, the Pd layer and the Au layer formed on the via portion of the base metal layer extend through the via.
5 more elements
A method of metallizing a ceramic package configured to house an electronic component, the method comprising:
- providing a ceramic substrate having a via formed therethrough;
- forming a base metal layer comprising a refractory metal on the ceramic substrate, the base metal layer having upper and lower portions formed on opposing major surfaces of the ceramic substrate and further having a via portion extending through the via and connecting the upper and lower portions, wherein the upper, lower and via portions form a continuous base metal layer having the same composition;
- forming a base nickel (Ni) layer on the base metal layer by a vapor phase process, wherein the base Ni layer is free of phosphorus (P) and boron (B) or has concentrations of P and B each less than 0.01% on the basis of a weight of the base Ni layer;
- forming a (Pd) layer over the base nickel layer by electroless plating;
- and
- forming a gold (Au) layer on the Pd layer,
- wherein one or more of the base Ni layer, the Pd layer and the Au layer formed on the via portion of the base metal layer extend through the via.
4 more elements
A ceramic package configured to house an electronic component, the ceramic package comprising:
- a ceramic substrate having a via formed therethrough;
- a base metal layer comprising a refractory metal, the base metal layer having upper and lower portions formed on opposing major surfaces of the ceramic substrate and further having a via portion extending through the via and connecting the upper and lower portions, wherein the upper, lower and via portions form a continuous base metal layer having the same composition;
- a base nickel (Ni) layer formed on the base metal layer, wherein the base Ni layer is free of phosphorus (P) and boron (B) or has concentrations of P and B each less than 0.01% on the basis of a weight of the base Ni layer;
- a palladium (Pd) layer formed over the base Ni layer;
- and
- a gold (Au) layer formed on the palladium layer,
- wherein one or more of the base Ni layer, the Pd layer and the Au layer formed on the via portion of the base metal layer extend through the via.
4 more elements
A ceramic package configured to house an electronic component, the ceramic package comprising:
- a ceramic substrate having a via formed therethrough;
- a first base metal layer and a second base metal layer formed at different locations on the ceramic substrate and comprising a refractory metal, the first base metal layer having upper and lower portions formed on opposing major surfaces of the ceramic substrate and further having a via portion extending through the via and connecting the upper and lower portions, wherein the upper, lower and via portions form a continuous base metal layer having the same composition,
- wherein the first and second base metal layers have formed thereon different metal layer stacks each comprising:
- a base nickel (Ni) layer that is free of phosphorus (P) and boron (B) or has concentrations of P and B each less than 0.01% on the basis of a weight of the base Ni layer;
- a Ni layer over the base Ni layer;
- a palladium (Pd) layer formed on the Ni layer;
- and
- a gold (Au) layer formed on the Pd layer,
- wherein one or more of the base Ni layer, the Pd layer and the Au layer formed on the via portion of the first base metal layer extend through the via.
6 more elements
A ceramic package configured to house an electronic component, the ceramic package comprising:
- a ceramic substrate having a via formed therethrough;
- a base metal layer comprising a refractory metal, the base metal layer having upper and lower portions formed on opposing major surfaces of the ceramic substrate and further having a via portion extending through the via and connecting the upper and lower portions, wherein the upper, lower and via portions form a continuous base metal layer having the same composition;
- a base nickel (Ni) layer formed on the base metal layer, wherein the base Ni layer is free of phosphorus (P) and boron (B) or has concentrations of P and B each less than 0.01% on the basis of a weight of the base Ni layer;
- a palladium (Pd) layer formed over the base Ni layer;
- and
- a gold (Au) layer formed on the palladium layer,
- wherein the base Ni layer, the Pd layer and the Au layer are formed on both ends of the via formed through the ceramic substrate.
4 more elements
A ceramic package configured to house an electronic component, the ceramic package comprising:
- a ceramic substrate having a via formed therethrough;
- a first base metal layer and a second base metal layer formed at different locations on the ceramic substrate and comprising a refractory metal, the first base metal layer having upper and lower portions formed on opposing major surfaces of the ceramic substrate and further having a via portion extending through the via and connecting the upper and lower portions, wherein the upper, lower and via portions form a continuous base metal layer having the same composition,
- wherein the first and second base metal layers have formed thereon different metal layer stacks each comprising:
- a base nickel (Ni) layer that is free of phosphorus (P) and boron (B) or has concentrations of P and B each less than 0.01% on the basis of a weight of the base Ni layer;
- a Ni layer over the base Ni layer;
- a palladium (Pd) layer formed on the Ni layer;
- and
- a gold (Au) layer formed on the Pd layer,
- wherein the base Ni layer, the Pd layer and the Au layer are formed on both ends of the via formed through the ceramic substrate.
6 more elements
Dependencies are inferred from the claim text.