US 11,309,249 B2 · Semiconductor package with air gap and manufacturing method thereof

Abstract

The present application provides a semiconductor package with air gaps for reducing capacitive coupling between conductive features and a method for manufacturing the semiconductor package. The semiconductor package includes a first semiconductor structure and a second semiconductor structure bonded with the first semiconductor structure. The first semiconductor structure has a first bonding surface. The second semiconductor structure has a second bonding surface partially in contact with the first bonding surface. A portion of the first bonding surface is separated from a portion of the second bonding surface, a space between the portions to of the first and second bonding surfaces is sealed and forms an air gap in the semiconductor package.

Claims13

Dependent claims

A semiconductor package, comprising:

a first semiconductor structure, having a first surface and a first recess recessed from the first surface, and comprising first conductive structures protruding from a bottom surface of the first recess;
and
a second semiconductor structure, having a second surface and second recesses recessed from the second surface, and comprising second conductive structures protruding from the second surface, wherein the second semiconductor structure is bonded onto the first semiconductor structure, top surfaces of the first conductive structures are in contact with the second recesses, top surfaces of the second conductive structures are in contact with the bottom surface of the first recess, a portion of the second surface is in contact with the first surface to seal the first recess, so as to form an air gap in the semiconductor package.

Dependencies are inferred from the claim text.

Semiconductor package with air gap and manufacturing method thereof

Life of this patent

Semiconductor package with air gap and manufacturing method thereof

Life of this patent

Abstract

Claims13