Package having different metal densities in different regions and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Wei Chen, Jie Chen, Ming-Fa Chen, Sen-Bor Jan
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Abstract
A package has a first region and a second region. The package includes a first die, a second die, an encapsulant, and an inductor. The second die is stacked on and bonded to the first die. The encapsulant is aside the second die. At least a portion of the encapsulant is located in the second region. The inductor is located in the second region. A metal density in the first region is greater than a metal density in the second region.
Claims20
A package having a first region and a second region, comprising:
- a first die;
- a second die stacked on and bonded to the first die;
- an encapsulant aside the second die, wherein at least a portion of the encapsulant is located in the second region;
- and
- an inductor located in the second region, wherein a metal density in the first region is greater than a metal density in the second region.
A package, comprising:
- a first die, comprising bonding pads and dummy bonding pads, wherein a pattern density of the bonding pads is greater than a pattern density of the dummy bonding pads;
- a second die bonded to the first die, wherein the second die covers the bonding pads;
- an encapsulant disposed on the first die, wherein the encapsulant laterally encapsulates the second die and covers the dummy bonding pads;
- and
- an inductor over the dummy bonding pads.
A manufacturing method of a package, comprising:
- providing a wafer substrate having a first region and a second region, comprising:
- forming first bonding pads having a first pattern density in the first region;
- and
- forming dummy bonding pads having a second pattern density in the second region, wherein the first pattern density is greater than the second pattern density;
- placing a die on the first region of the wafer substrate, wherein the die comprises second bonding pads hybrid bonded to the first bonding pads;
- encapsulating the die by an encapsulant;
- and
- forming an inductor over the second region.
Dependencies are inferred from the claim text.