Package component, semiconductor package and manufacturing method thereof

A manufacturing method of a semiconductor package, comprising:

• forming a package component comprising:
• forming a first interconnect layer and a second interconnect layer on a dielectric material layer;
• forming a first via pattern on the first interconnect layer within a functional circuit region and a second via pattern on the second interconnect layer within a seal ring region, wherein the functional circuit region is encircled by the seal ring region, and the second via pattern comprises a plurality of features isolated from one another;
• and
• laminating an insulating layer to cover the first via pattern, the first interconnect layer, the second via pattern, and the second interconnect layer, wherein the first via pattern and the first interconnect layer are isolated from the second via pattern and the second interconnect layer by the insulating layer;
• and
• coupling a first semiconductor die to the package component, wherein a portion of the dielectric material layer is removed to form a dielectric layer with openings accessibly exposing at least a portion of the first interconnect layer after coupling the first semiconductor die to the package component.