US 11,309,238 B2Granted

Layout structure of a flexible circuit board

AssigneeChipbond Technology Corporation

InventorsYu-Chen Ma, Hsin-Hao Huang, Wen-Fu Chou, Gwo-Shyan Sheu

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Abstract

A layout structure of flexible circuit board includes a flexible substrate, a chip and a circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate, the circuit area surrounds the chip mounting area. The chip is mounted on the chip mounting area of the top surface and includes a bump. The circuit layer is disposed on the top surface. A connection portion of the circuit layer extends across a first side of the chip mounting area and into the chip mounting area. A transmission portion of the circuit layer is located on the circuit area and electrically connected to the connection portion. A stress release portion of the circuit layer is located between the transmission portion and a second side of the chip mounting area and is a comb-shaped structure.

Claims16

Dependent claims

A layout structure of flexible circuit board comprising:

a flexible substrate including a top surface, a chip mounting area and a circuit area are defined on the top surface, the circuit area surrounds the chip mounting area having a first side and a second side;
a chip mounted on the chip mounting area of the top surface and including a bump;
and
a circuit layer disposed on the top surface and including a connection portion, a transmission portion and a stress release portion, the connection portion extends across the first side and into the chip mounting area and is electrically connected to the bump, the transmission portion is located on the circuit area and adjacent to the second side, a space of between 100 um and 800 um exists between the transmission portion and the second side of the chip mounting area, the stress release portion is located between the transmission portion and the second side of the chip mounting area and is a comb-shaped structure.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 17/227,470Filed 12 Apr 2021
Priority: TW 10912604731 Jul 2020
Published: US 2022/0037238 A13 Feb 2022
Granted: 19 Apr 2022
Term ends: Not estimatedThe source records don’t support an estimate.

Classification18 codes

H10W 70/688
Characterised by their insulating layers or insulating parts: flexible insulating substrates
H05K 1/0271
Details: arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal…
H05K 1/189
Structurally associated with non-printed electric components: characterised by the use of flexible or folded printed circuits
H10W 70/65
Characterised by their interconnections: shapes or dispositions of interconnections

Family

US 2022/0037238 A1Pre-grant publication · published 3 Feb 2022
US 11,309,238 B2This patent

From the US filing history. Foreign family members aren’t listed.

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