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US 11,309,237 B2Granted
Semiconductor package with wettable slot structures
AssigneesSTMicroelectronics S.r.l., STMicroelectronics (Malta) Ltd
InventorsMarco Del Sarto, Alex Gritti, Pierpaolo Recanatini, Michael Borg
Life of this patent
Estimating the term…
Abstract
The present disclosure is directed to a semiconductor package including a substrate having a lower surface with a plurality of slot structures. The plurality of slot structures are multi-layer structures that encourage the formation of solder joints. The semiconductor package is desirable for high reliability applications in which each solder joint termination should be checked by visual systems to ensure a proper electrical connection has been made.
Claims19
A substrate, comprising:
- a plurality of slot structures positioned along a perimeter of the substrate, each of the plurality of slot structures including:
- a first conductive layer;
- a first support layer;
- a second conductive layer, the first support layer positioned between the first conductive layer and the second conductive layer;
- a second support layer;
- a third conductive layer on the second support layer, the second support layer positioned between the second conductive layer and the third conductive layer;
- and
- a slot extending into an edge portion of the first support layer, the slot having a base that is the second conductive layer and a sidewall that is the first support layer, a continuous portion of the first conductive layer being on the edge portion of the first support layer, the base, and the sidewall;
- and
- a pillar extending from the continuous portion of the first conductive layer that is on the edge portion of the first support layer, through the first support layer, and to the second conductive layer.
7 more elements
A substrate, comprising:
- a plurality of slots;
- a first conductive layer;
- a first support layer, the plurality of slots extending into edge portions of the first support layer, the first support layer forming sidewalls of the plurality of slots;
- a second conductive layer spaced from the first conductive layer by the first support layer, the second conductive layer forming bases of the plurality of slots, portions of the first conductive layer being on the edge portions of the first support layer, the sidewalls of the plurality of slots, and the bases of the plurality of slots;
- a plurality of pillars, each of the portions of the first conductive layer being spaced from the second conductive layer by a respective pillar of the plurality of pillars;
- a second support layer;
- and
- a third conductive layer spaced from the second conductive layer by the second support layer.
5 more elements
A package, comprising:
- a substrate having a first side and a second side opposite the first side, the substrate including a plurality of slot structures positioned along a perimeter of the substrate on the second side, each of the plurality of slot structures including:
- a planar surface;
- a slot extending into an edge portion of the planar surface, the slot having a base and a sidewall, the planar surface being positioned along three sides of the slot;
- a conductive layer on the edge portion of the planar surface, the base, and the sidewall;
- and
- a pillar directly underlying a portion of the conductive layer that is on the edge portion of the planar surface;
- and
- a die on the first side of the substrate.
5 more elements
Dependencies are inferred from the claim text.