Semiconductor device

A semiconductor device, comprising:

• a substrate having a first surface;
• a first semiconductor chip mounted to the first surface of the substrate and connected to the substrate by a first plurality of bonding wires;
• a plurality of spacer chips mounted on the first surface of the substrate, each spacer chip in the plurality being between the first semiconductor chip and an outer edge of the substrate, each spacer chip being spaced from other spacer chip;
• a second semiconductor chip mounted on a first pair of spacer chips in the plurality of spacer chips, the first pair being spaced from each other in a first direction;
• and
• a projecting portion on the first surface of the substrate between the first pair of spacers in the first direction, the projecting portion being between the first plurality of bonding wires and the outer edge of the substrate in a second direction orthogonal to the first direction, the projecting portion protruding upward from the first surface of the substrate, wherein
• the first semiconductor chip extends from the first surface to a first height, and
• each spacer chip in the plurality extends from the first surface to a second height that is greater than the first height.

A semiconductor device, comprising:

• a planar substrate having a first surface;
• a first semiconductor chip mounted on the first surface and connected to the planar substrate by a first plurality of bonding wires, the first semiconductor chip having a substantially rectangular planar shape, the first semiconductor chip extending to a first height above the first surface in a first direction;
• a first spacer chip mounted on the first surface of the substrate between a first corner of the first semiconductor chip and an outer edge of the planar substrate;
• a second spacer chip mounted on the first surface of the substrate between a second corner of the first semiconductor chip and the outer edge of the planar substrate, the second spacer chip being spaced from the first spacer chip in a second direction along the first surface;
• a second semiconductor chip mounted on the first spacer chip and the second spacer chip, the second semiconductor chip spanning extending in the second direction from the first spacer chip to the second spacer chip while leaving a gap between a lower surface of the second semiconductor chip and the first surface of the substrate in the first direction;
• and
• a projecting section on the first surface of the substrate between the first and second spacers chips in the second direction, the projecting section being between the first plurality of bonding wires and the outer edge of the substrate in a third direction along the first surface crossing the second direction, the projecting section being disposed in the gap between the lower surface of second semiconductor chip and the first surface of the substrate.

A method of forming a semiconductor device, comprising:

• forming a first pair of spacers on a surface of substrate, the spacers of the first pair having a first height and being spaced from each other by a first distance along a first direction;
• placing a first semiconductor chip on the surface of the substrate;
• connecting the first semiconductor chip to the surface of the substrate with a first plurality of bonding wires;
• mounting a second semiconductor chip on the first pair of spacers, the second semiconductor chip spanning the first distance and being above the first semiconductor chip;
• and
• forming a projecting section on the surface of the substrate between the first pair of spacers in the first direction, the projecting section being between the first plurality of bonding wires and an outer edge of the substrate and protruding upward from the surface.