Coating composition(s)

An electronic device comprising a heat dissipation coating composition, wherein the heat dissipation coating composition comprises:

• a transparent coating layer deposited on a surface of the electronic device, wherein the transparent coating layer comprises:
• a heat absorber selected from the group consisting of silica aerogel, carbon nanotube aerogel, graphene aerogel, and combinations thereof,
• a transparent resin selected from the group consisting of a polyacrylic resin, a polycarbonate resin, a cyclic olefin resin, an epoxy resin, a urethane resin, a silicone resin, a cyanoacrylate resin, a polyester resin, and combinations thereof, and
• a solvent;
• and
• a heat spreader layer deposited at least partially on top of the transparent coating layer or deposited on the surface of the electronic device adjacent to the transparent coating layer, wherein the heat spreader layer comprises:
• metallic or non-metallic particles selected from the group consisting of copper, aluminum, graphite, carbon nanotube, graphene on a metal, graphene, and combinations thereof,
• wherein the heat spreader layer is deposited to coat 50% or less of the top of the transparent coating layer;
• or
• wherein the heat spreader layer is deposited on the surface of the electronic device adjacent to the transparent coating layer spreader layer to coat 50% or less of the surface of the electronic device.