Back to results
US 11,309,223 B2Granted
Method of forming semiconductor device package having dummy devices on a first die
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Hui-Wen Liu, Ching-Pin Yuan
Life of this patent
Estimating the term…
Abstract
In an embodiment, a method includes: stacking a plurality of first dies to form a device stack; revealing testing pads of a topmost die of the device stack; testing the device stack using the testing pads of the topmost die; and after testing the device stack, forming bonding pads in the topmost die, the bonding pads being different from the testing pads.
Claims20
A method comprising:
- bonding a first die to a first carrier substrate;
- stacking a plurality of second dies and a plurality of dummy devices on the first die to form a device stack;
- bonding a second carrier substrate to the plurality of second dies and the plurality of dummy devices of the device stack;
- removing the first carrier substrate from the first die;
- forming conductive bumps on the first die;
- testing the first die and the device stack using the conductive bumps of the first die;
- and
- singulating the second carrier substrate and portions of the dummy devices to form a first device package.
5 more elements
A method comprising:
- bonding a logic device to a first carrier substrate, the first carrier substrate comprising first alignment marks;
- bonding a first memory device to the logic device;
- bonding a first dummy device to the logic device adjacent the first memory device, the first dummy device comprising second alignment marks, wherein bonding the first dummy device comprises aligning the second alignment marks with a first subset of the first alignment marks;
- bonding a second memory device to the first memory device;
- bonding a second dummy device to the first dummy device adjacent the second memory device, the second dummy device comprising third alignment marks, wherein bonding the second dummy device comprises aligning the third alignment marks with a second subset of the first alignment marks;
- removing the first carrier substrate from the logic device;
- after removing the first carrier substrate, testing the logic device, the first memory device, and the second memory device;
- and
- after testing the logic device, the first memory device, and the second memory device, bonding the logic device to a package substrate.
6 more elements
A method comprising:
- bonding a first die to a first carrier substrate, the first die having a first function;
- stacking second dies and dummy devices on the first die, each of the second dies having a second function;
- removing the first carrier substrate from the first die to expose an active surface of the first die;
- forming conductive bumps at the active surface of the first die;
- testing the first die and the second dies using the conductive bumps;
- and
- singulating the first die and portions of the dummy devices to form a first device package.
4 more elements
Dependencies are inferred from the claim text.