Semiconductor chip with solder cap probe test pads
AssigneeAdvanced Micro Devices, Inc.
InventorsLei Fu, Milind S. Bhagavat, Chia-Hao Cheng
Life of this patent
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Abstract
Various semiconductor chips with solder capped probe test pads are disclosed. In accordance with one aspect of the present invention, a semiconductor chip is provided that includes a substrate, plural input/output (I/O) structures on the substrate and plural test pads on the substrate. Each of the test pads includes a first conductor pad and a first solder cap on the first conductor pad.
Claims20
A semiconductor chip, comprising:
- a substrate;
- plural input/output (I/O) structures on the substrate;
- plural test pads on the substrate, each of the test pads including a first conductor pad and a first solder cap on the first conductor pad, wherein the first solder cap is configured, without reflow, to receive a test probe;
- and
- a polymer structure positioned over the first solder cap without reflow.
A method of manufacturing a semiconductor chip having a substrate, comprising:
- fabricating plural input/output (I/O) structures on the substrate;
- fabricating plural test pads on the substrate, each of the test pads including a first conductor pad and a first solder cap on the first conductor pad, wherein the first solder cap is configured, without reflow, to receive a test probe;
- and
- fabricating a polymer structure over the first solder cap without reflow.
A method of testing a semiconductor chip, the semiconductor chip having a substrate, plural first conductor pads on the substrate and plural test pads on the substrate each including a second conductor pad and a first solder cap on the second conductor pad, the method comprising:
- without reflow, contacting one or more probe pins on one or more of the first solder caps;
- probe testing the semiconductor chip;
- and
- fabricating a polymer structure over the one or more first solder caps without reflow.
Dependencies are inferred from the claim text.