Detection of adhesive residue on a wafer
AssigneeInfineon Technologies AG
InventorsRobert Muhr, Matthias Fehr, Walter Leitgeb
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Abstract
A method of detecting adhesive residue on a wafer after peeling an adhesive film from the wafer by using a peeling tape is described. According to a first aspect, the method includes illuminating the peeling tape with first UV light after the peeling and acquiring a fluorescence image from the peeling tape. According to a second aspect, the method includes illuminating the wafer with second UV light after the peeling and acquiring a fluorescence image from the wafer.
Claims19
A method of detecting adhesive residue the method comprising:
- applying an adhesive film on an upper surface of a wafer;
- peeling the adhesive film away from the upper surface of the wafer by using a peeling tape;
- illuminating the peeling tape with first UV light after the peeling;
- and
- acquiring a fluorescence image from the peeling tape and/or illuminating the wafer with second UV light after the peeling;
- and
- acquiring a fluorescence image from the wafer,
- wherein the fluorescence image is acquired from the wafer after the peeling.
An apparatus for detecting adhesive residue the apparatus comprising:
- a mechanism configured to apply an adhesive film on an upper surface of a wafer and to peel an adhesive film away from the upper surface of the wafer by using a peeling tape;
- and
- a first UV light source configured to illuminate the peeling tape that with first UV light after the peeling;
- and
- a first camera configured to acquire a fluorescence image from the peeling tape and/or a second UV light source configured to illuminate the wafer with second UV light after the peeling;
- and
- a second camera configured to acquire a fluorescence image from the wafer,
- wherein the second camera is configured to acquire the fluorescence image from the wafer with the second UV light after the peeling.
Dependencies are inferred from the claim text.