Heating element, substrate processing apparatus and method of manufacturing semiconductor device

A substrate processing apparatus comprising:

• a substrate retainer capable of supporting a substrate;
• a process chamber where the substrate retainer is accommodated and the substrate is processed;
• a heater capable of heating the substrate by microwaves;
• and
• a heating element of an annular shape, made of a dielectric material capable of generating heat by the microwaves,
• wherein an inner circumferential portion of the heating element is located outer than an outer circumferential portion of the substrate, and the heating element is supported by the substrate retainer at a position above the substrate and without contacting the substrate.

A method of manufacturing a semiconductor device comprising:

• (a) loading a substrate into a process chamber of a substrate processing apparatus, the substrate processing apparatus comprising:
• a substrate retainer capable of supporting theft substrate;
• a process chamber where the substrate retainer is accommodated and the substrate is processed;
• a heater capable of heating the substrate by microwaves;
• and
• a heating element of an annular shape, made of a dielectric material capable of generating heat by the microwaves, wherein an inner circumferential portion of the heating element is located outer than an outer circumferential portion of the substrate, and the heating element is supported by the substrate retainer at a position above the substrate and without contacting the substrate;
• (b) processing the substrate by supplying the microwaves to heat the substrate and the heating element;
• and
• (c) unloading the substrate after (b).