Integrated circuit package supports
AssigneeIntel Corporation
InventorsKristof Kuwawi Darmawikarta, Robert May, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Chung Kwang Christopher Tan, Aleksandar Aleksov
Life of this patent
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Abstract
Disclosed herein are integrated circuit (IC) package supports and related apparatuses and methods. For example, in some embodiments, an IC package support may include a non-photoimageable dielectric, and a conductive via through the non-photoimageable dielectric, wherein the conductive via has a diameter that is less than 20 microns. Other embodiments are also disclosed.
Claims25
An electronic apparatus, comprising:
- an integrated circuit (IC) package support, including:
- a first dielectric material,
- a first conductive via in the first dielectric material, wherein the first conductive via has tapered sidewalls with an angle that is equal to or less than 80 degrees,
- a second dielectric material on the first dielectric material, wherein the second dielectric material is non-photoimageable, and
- a second conductive via in the second dielectric material, wherein the second conductive via has tapered sidewalls with an angle that is greater than 80 degrees.
An electronic apparatus, comprising:
- an integrated circuit (IC) package support, including:
- a first dielectric material having a planar top surface, wherein the first dielectric material includes first filler particles having a first particle size,
- a first conductive via in the first dielectric material, wherein the first conductive via has tapered sidewalls with an angle that is equal to or less than 80 degrees,
- a second dielectric material on the top surface of the first dielectric material, wherein the second dielectric material includes second filler particles having a second particle size, and the second particle size is smaller than the first particle size, and
- a second conductive via in the second dielectric material, wherein the second conductive via has tapered sidewalls with an angle that is greater than 80 degrees.
An electronic apparatus, comprising:
- an integrated circuit (IC) package support, including:
- a first dielectric material having a planar top surface,
- a first conductive via in the first dielectric material, wherein the first conductive via has tapered sidewalls with an angle that is equal to or less than 80 degrees,
- a second dielectric material on the top surface of the first dielectric material, and
- a second conductive via in the second dielectric material, wherein the second conductive via has tapered sidewalls with an angle that is greater than 80 degrees.
An electronic apparatus, comprising:
- an integrated circuit (IC) package support, including:
- a first dielectric material,
- a first conductive via in the first dielectric material, wherein the first conductive via has tapered sidewalls with an angle that is equal to or less than 80 degrees,
- a second dielectric material on the first dielectric material,
- a conductive pad in the second dielectric material,
- a second conductive via in the second dielectric material and in electrical contact with the conductive pad, wherein the second conductive via has tapered sidewalls with an angle that is greater than 80 degrees, and
- an adhesion promoter material on the sidewalls of the second conductive via and on sidewalls of the conductive pad, wherein the adhesion promoter material is not between the second conductive via and the conductive pad.
Dependencies are inferred from the claim text.