Treatment systems with repositionable nozzle useful in the manufacture of microelectronic devices

A system for treating a microelectronic substrate with at least one treatment fluid, said system comprising:

• a) a housing enclosing a sealed chamber, wherein the housing includes an egress in an upper wall;
• b) a chuck comprising a substrate holding portion in the sealed chamber, wherein the microelectronic substrate is positioned on the substrate holding portion during a process treatment;
• c) a flexible and/or resizable enclosure coupled to the sealed chamber and mounted onto the housing over the egress, said flexible and/or resizable enclosure comprising a flexible bellows coupled to a moveable and positionable support member in a manner such that actuation of the flexible bellows moves the moveable and positionable support member;
• d) a moveable and positionable nozzle assembly coupled to the support member in a manner effective to allow the nozzle assembly to be moved and positioned relative to the substrate holding portion in response to movement and positioning of the moveable and positionable support member in response to actuation of the flexible bellows, wherein the nozzle assembly comprises at least one inlet to receive at least one fluid from at least one fluid supply and at least one outlet to introduce at least one fluid into the sealed chamber.