Memory device transmitting small swing data signal and operation method thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsByongmo Moon, Sungoh Ahn
Life of this patent
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AssigneeSamsung Electronics Co., Ltd.
InventorsByongmo Moon, Sungoh Ahn
Estimating the term…
Disclosed is a memory device, which includes a buffer die that outputs a first power supply voltage to a first through-substrate via (e.g., through-silicon via (TSV)) and receives a small swing data signal from a second TSV generated based on the first power supply voltage, and a core die that is electrically connected to the buffer die through the first and second TSVs, includes a first cell capacitor electrically connected to the first TSV and configured to block a first noise introduced to the first power supply voltage received through the first TSV. The core die outputs the small swing data signal to the second TSV.
A memory device comprising:
A memory device comprising:
An operation method of a memory device which includes a buffer die and a core die electrically connected to the buffer die through a first through-substrate via (TSV) and a second TSV, the method comprising:
Dependencies are inferred from the claim text.