Cascade defect inspection

A computer system comprising:

• a memory storing instructions;
• and
• a processor electronically coupled to the memory and configured to execute the instructions to cause the computer system to:
• receive inspection data representing an image of a wafer;
• determine, in first inspection data representing the image of the wafer, a first set of points of interests (POIs) having a first property;
• determine, in second inspection data representing the image of the wafer, a second set of POIs having a second property, wherein the second inspection data does not include the first set of POIs;
• determine, in the second set of POIs, a third set of POIs having a third property;
• and
• report the third set of POIs as defects having both the second property and the third property.

A method comprising:

• receiving inspection data representing an image of a wafer;
• inputting first inspection data to a first module of a plurality of modules, each of the plurality of modules being configured to detect defects with a different property, wherein the first module outputs a first set of points of interests (POIs) having a first property;
• inputting second inspection data to a second module of the plurality of modules, wherein the second inspection data does not include the first set of POIs, and the second module outputs a second set of POIs having a second property;
• inputting the second set of POIs to a third module of the plurality of modules, wherein the third module outputs a third set of POIs having a third property;
• and
• reporting the third set of POIs as defects having both the second property and the third property.