US 11,308,257 B1 · Stacked via rivets in chip hotspots

Abstract

A structure including a plurality of dielectric regions is described. The structure can include a rivet cell. The rivet cell can include a set of stacked vias. The rivet cell can extend through a stress hotspot of the structure. A length of the rivet cell can thread through at least one dielectric region among the plurality of dielectric regions. The rivet cell can be among a number of rivet cells inserted in the stress hotspot. The stress hotspot can be among a plurality of stress hotspots across the structure. A length of the rivet cell can be based on a model of a relationship between the length of the rivet cell and an energy release rate of the structure. The rivet cell can thread through an interface between a first dielectric region and a second dielectric region having different dielectric constants.

Claims17

Dependent claims

A method for determining a location of a rivet cell in a structure, the method comprising:

modeling a location of a stress hotspot in a structure;
modeling a relationship between a length of a rivet cell and an energy release rate of the structure;
identifying an optimal length of the rivet cell based on the modeled relationship;
generating rivet cell data that indicates an insertion location of the rivet cell, wherein the insertion location is based on the location of the stress hotspot;
and
sending the rivet cell data to a device to instruct the device to construct the structure in accordance with the rivet cell data, such that the structure is constructed to include the rivet cell at the insertion location, and such that the rivet cell extends through the stress hotspot of the structure, and threads through at least one dielectric region among a plurality of dielectric regions of the structure.

3 more elements

A computer program product for determining a location of a rivet cell in a structure, the computer program product comprising a computer readable storage medium having program instructions embodied therewith, the program instructions executable by a processing element of a device to cause the device to:

model a location of a stress hotspot in a structure;
model a relationship between a length of a rivet cell and an energy release rate of the structure;
identify an optimal length of the rivet cell based on the modeled relationship;
generate rivet cell data that indicates an insertion location of the rivet cell, wherein the insertion location is based on the location of the stress hotspot;
and
send the rivet cell data to a device to instruct the device to construct the structure in accordance with the rivet cell data, such that the structure is constructed to include the rivet cell at the insertion location, and such that the rivet cell extends through the stress hotspot of the structure, and threads through at least one dielectric region among a plurality of dielectric regions of the structure.

3 more elements

Dependencies are inferred from the claim text.

Stacked via rivets in chip hotspots

Life of this patent

Stacked via rivets in chip hotspots

Life of this patent

Abstract

Claims17