Data processing method, data processing apparatus and processing apparatus

A processing apparatus comprising:

• a processing chamber to be a control object, wherein the processing chamber subjects a sample mounted on a sample stage to a plasma process;
• a measuring device configured to obtain data relating to the processing chamber;
• a calculation processing device configured to perform data processing under a data processing program that includes the steps of:
• calculating, using a double exponential smoothing method in which the data relating to the processing chamber is set as input data, a first predicted value that is a predicted value of smoothed data and a second predicted value that is a predicted value of a gradient of the smoothed data as output data;
• and
• calculating, using a double exponential smoothing method in which the second predicted value calculated as the output data is set as input data, a third predicted value that is a predicted value of smoothed data and a fourth predicted value that is a predicted value of a gradient of the smoothed data as output data;
• and
• a controller configured to perform a determination of an end point in time of the plasma process under the data processing.

A processing apparatus comprising:

• a processing chamber to be a control object, wherein the processing chamber subjects a sample mounted on a sample stage to a plasma process;
• a measuring device which is configured to obtain data relating to the processing chamber;
• a data calculation processing device configured to perform data processing under a data processing program that uses a responsive double exponential smoothing method in which smoothing parameters are varied in accordance with an error between the data obtained by the measuring device and the predicted value of smoothed data, and that processes data while making a lower limit value of a variable range of the smoothing parameters greater than zero;
• and
• a controller configured to perform a determination of an end point in time of a plasma process under the data processing.

A processing apparatus comprising:

• a processing chamber in which a sample mounted on a sample stage is subjected to a plasma process;
• a measuring device configured to obtain light emission data in the plasma process of the sample;
• a data calculation processing device configured to perform data processing under a data processing program that uses a responsive double exponential smoothing method in which smoothing parameters are varied in accordance with an error between the data obtained by the measuring device and the predicted value of smoothed data, and that processes data while making a lower limit value of the variable range of the smoothing parameters greater than zero and
• a controller configured to perform a determination of an end point in time of the plasma process under the data processing.

A plasma processing apparatus comprising a processing chamber in which a sample mounted on a sample stage is subjected to the plasma process is connected to a calculation processing device configured to perform a processing of data regarding a plasma process, wherein

• the calculation processing device is configured to perform data processing under a data processing program that includes the steps of:
• calculating, using a double exponential smoothing method in which the data is set as input data, a first predicted value that is a predicted value of smoothed data and a second predicted value that is a predicted value of a gradient of the smoothed data as output data;
• and
• calculating, using a double exponential smoothing method in which the second predicted value calculated as the output data is set as input data, a third predicted value that is a predicted value of smoothed data and a fourth predicted value that is a predicted value of a gradient of the smoothed data as output data;
• and
• a controller is configured to perform a determination of an end point in time of the plasma process under the data processing.