Virtualized link states of multiple protocol layer package interconnects
AssigneeIntel Corporation
InventorsJoon Teik Hor, Ting Lok Song, Mahesh Wagh, Su Wei Lim
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AssigneeIntel Corporation
InventorsJoon Teik Hor, Ting Lok Song, Mahesh Wagh, Su Wei Lim
Estimating the term…
Systems, methods, and devices can include a first die comprising a first arbitration and multiplexing logic, a first protocol stack associated with a first interconnect protocol, and a second protocol stack associated with a second interconnect protocol. A second die comprising a second arbitration and multiplexing logic. A multilane link connects the first die to the second die. The second arbitration and multiplexing logic can send a request to the first arbitration and multiplexing logic to change a first virtual link state associated with the first protocol stack. The first arbitration and multiplexing logic can receive, from across the multilane link, the request from the first die indicating a request to change the first virtual link state; determine that the first interconnect protocol is ready to change a physical link state; and change the first virtual link state according to the received request while maintaining a second virtual link state.
An apparatus comprising:
A method performed by physical layer circuitry (PHY), the method comprising:
A system comprising:
Dependencies are inferred from the claim text.