On-chip high capacitance termination for transmitters

A method for modulating a semiconductor modulator, the method comprising:

• applying a modulation signal to a contact, wherein the contact is integrated on a substrate that is part of a platform;
• transmitting the modulation signal to a semiconductor structure, wherein:
• the semiconductor structure has a direct bandgap,
• the semiconductor structure is integrated on the substrate,
• the semiconductor structure is bonded within a recess of the platform,
• the semiconductor structure comprises a first optical waveguide,
• the first optical waveguide is a semiconductor waveguide, and
• the modulation signal applied to the semiconductor structure modulates an optical beam in the first optical waveguide of the semiconductor structure to form a modulated beam;
• shunting the semiconductor structure with a capacitor that is integrated on the substrate;
• and
• transmitting the modulated beam from the first optical waveguide into a second optical waveguide, wherein:
• the second optical waveguide is part of the platform, and
• the second optical waveguide is a semiconductor waveguide.