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US 11,307,368 B2Granted
Integration of power and optics through cold plates for delivery to electronic and photonic integrated circuits
AssigneeCisco Technology, Inc.
InventorJoel Richard Goergen
Life of this patent
Estimating the term…
Abstract
In one embodiment, an apparatus includes an upper cold plate and a lower cold plate, at least one of the upper cold plate or the lower cold plate comprising an electrical or optical path extending therethrough, a substrate and die package interposed between the upper cold plate or the lower cold plate, and a connector coupled to one of the upper cold plate or the lower cold plate for transmitting power or an optical signal through the electrical or optical path to the substrate and die package.
Claims20
An apparatus comprising:
- an upper cold plate and a lower cold plate, each of the upper cold plate or the lower cold plate comprising at least one of an electrical path or an optical path extending therethrough;
- a substrate and die package interposed between the upper cold plate and the lower cold plate;
- and
- a connector comprising a first connector coupled to the upper cold plate for transmitting at least one of power through said electrical path or an optical signal through the optical path, to the substrate and die package and a second connector coupled to the lower cold plate for transmitting at least one of the power through the electrical path or the optical signal through the optical path.
1 more element
An apparatus comprising:
- a first cold plate comprising an electrical path extending therethrough;
- a second cold plate comprising an optical path extending therethrough;
- a substrate and die package comprising at least one electronic integrated circuit and at least one photonic integrated circuit, the substrate and die package interposed between said first cold plate and said second cold plate;
- an electrical connector coupled to said first cold plate for transmitting power or electrical signals through said electrical path;
- and
- an optical connector coupled to said second cold plate for transmitting optical signals through said optical path,
- wherein one of the first cold plate or the second cold plate includes one or more openings for inserting a respective power delivery block therein.
4 more elements
A method comprising:
- creating an electrical path and an optical path through cold plates;
- positioning the cold plates on opposite sides of a substrate and die package;
- and
- transmitting power through said electrical path and an optical signal through said optical path,
- wherein the power is transmitted from a power connector coupled to one of the cold plates and the optical signal is transmitted from or received at an optical connector coupled to one of the cold plates,
- wherein one of the cold plates includes one or more openings for inserting a respective power delivery block therein.
3 more elements
Dependencies are inferred from the claim text.