Magnetic field sensor

A manufacturing method for manufacturing a magnetic field sensor having;

• a magnetoresistive sensor chip;
• a flat sensor carrier carrying the sensor chip and having an upper side and an underside, the upper side of the sensor carrier having a recess in the form of a penetration through the sensor carrier in which the sensor chip is arranged;
• the sensor chip being electrically contactable from the upper side of the sensor carrier via connection points provided on the sensor chip, and the sensor chip receiving via the underside of the sensor carrier a magnetic field to be measured which is generated by a generating sensor magnet movable along the underside of the sensor carrier;
• and
• a protective jacket filling in and/or covering the recess in the sensor carrier, the protective jacket having an ending flush with, or protruding above, the upper side of the sensor carrier for mechanical stabilization and passivation of the sensor chip,
• the method comprising:
• creating the recess in the form of the penetration through the sensor carrier extending from the upper side of the sensor carrier towards the underside of the sensor carrier;
• at least temporary fastening the sensor chip in the recess in the area of the underside of the sensor carrier by positioning and fixing the sensor chip on to a carrier film that is at least temporarily attached to the underside of the sensor carrier;
• bonding the sensor chip to bond pads of the sensor carrier;
• and
• filling in and/or covering of the recess with the protective jacket for mechanical stabilization and passivation of the sensor chip, the protective jacket being either flush with the upper side of the sensor carrier or protruding in the overlapping manner beyond the recess of the sensor carrier.

A manufacturing method for manufacturing a magnetic field sensor having;

• a magnetoresistive sensor chip;
• a flat sensor carrier carrying the sensor chip and having an upper side and an underside, the upper side of the sensor carrier having a recess in the form of a penetration through the sensor carrier in which the sensor chip is arranged;
• the sensor chip being electrically contactable from the upper side of the sensor carrier via connection points provided on the sensor chip, and the sensor chip receiving via the underside of the sensor carrier a magnetic field to be measured which is generated by a generating sensor magnet movable along the underside of the sensor carrier;
• and
• a protective jacket filling in and/or covering the recess in the sensor carrier, the protective jacket having an ending flush with, or protruding above, the upper side of the sensor carrier for mechanical stabilization and passivation of the sensor chip;
• the method comprising:
• creating the recess in the form of the penetration through the sensor carrier extending from the upper side of the sensor carrier towards the underside of the sensor carrier;
• at least temporary fastening the sensor chip in the recess in the area of the underside of the sensor carrier;
• bonding the sensor chip to bond pads of the sensor carrier;
• filling in and/or covering of the recess with the protective jacket for mechanical stabilization and passivation of the sensor chip, the protective jacket being either flush with the upper side of the sensor carrier or protruding in the overlapping manner beyond the recess of the sensor carrier;
• and
• grinding down a carrier substrate of the sensor chip to a substrate thickness of less than 100 μM.

A manufacturing method for manufacturing a magnetic field sensor having;

• a magnetoresistive sensor chip;
• a flat sensor carrier carrying the sensor chip and having an upper side and an underside, the upper side of the sensor carrier having a recess in the form of a penetration through the sensor carrier in which the sensor chip is arranged;
• the sensor chip being electrically contactable from the upper side of the sensor carrier via connection points provided on the sensor chip, and the sensor chip receiving via the underside of the sensor carrier a magnetic field to be measured which is generated by a generating sensor magnet movable along the underside of the sensor carrier;
• and
• a protective jacket filling in and/or covering the recess in the sensor carrier, the protective jacket having an ending flush with, or protruding above, the upper side of the sensor carrier for mechanical stabilization and passivation of the sensor chip;
• the method comprising:
• creating the recess in the form of the penetration through the sensor carrier extending from the upper side of the sensor carrier towards the underside of the sensor carrier;
• at least temporary fastening the sensor chip in the recess in the area of the underside of the sensor carrier;
• bonding the sensor chip to bond pads of the sensor carrier;
• filling in and/or covering of the recess with the protective jacket for mechanical stabilization and passivation of the sensor chip, the protective jacket being either flush with the upper side of the sensor carrier or protruding in the overlapping manner beyond the recess of the sensor carrier;
• and
• grinding flat the underside of the sensor carrier at least in an area around the recess after embedding of the sensor chip.