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US 11,306,980 B2Granted
Heat sink and thermal dissipation system
AssigneesInventec (Pudong) Technology Corporation, Inventec Corporation
InventorsKai-Yang Tung, Hung-Ju Chen
Life of this patent
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Abstract
A heat sink includes a bottom plate, a liquid barrier structure and a microstructure used for heat dissipation. The liquid barrier wall is arranged on the bottom plate. The liquid barrier wall is closed on the bottom plate to form a container. The microstructure for heat dissipation is arranged in the container and includes porous materials or 3D-structures with small sizes.
Claims7
A heat sink used for a droplet-cooling type heat dissipation system, comprising:
- a bottom plate;
- a liquid barrier wall disposed upon and surrounding the bottom plate to form a container;
- a porous structure filled in the container formed by the liquid barrier wall;
- a locking structure disposed on the bottom plate and within the container;
- an isolation wall disposed on the bottom plate;
- and
- a plurality of heat conducting fins disposed in the container, wherein a plurality of microstructures are disposed on the bottom plate and the heat conducting fins and the microstructures are raised on recessed from the heat conducting fins and the bottom plate,
- wherein the locking structure is adjacent to a periphery of the container, the isolation wall is connected to the liquid barrier wall to form a closed chamber, and the locking structure is disposed in the closed chamber.
5 more elements
A thermal dissipation system, comprising:
- a heat sink being disposed on a heat source, wherein the heat sink comprises:
- a bottom plate;
- a liquid barrier wall disposed upon and surrounding the bottom plate to form a container;
- a porous structure filled in the container formed by the liquid barrier wall;
- a locking structure disposed on the bottom plate and within the container;
- an isolation wall disposed on the bottom plate;
- and
- a plurality of heat conducting fins disposed in the container, wherein a plurality of microstructures are disposed on the bottom plate and the heat conducting fins and the microstructures are raised on recessed from the heat conducting fins and the bottom plate, wherein the locking structure is adjacent to a periphery of the container, the isolation wall is connected to the liquid barrier wall to form a closed chamber, and the locking structure is disposed in the closed chamber;
- and
- a coolant source disposed above the heat sink, wherein the coolant source is configured to drip coolant toward the container of the heat sink,
- wherein the coolant source drips the coolant toward the heat sink, the coolant receives the heat conducted by the heat sink and has a phase changing to dissipate the heat, thereby exerting a heat dissipation effect.
8 more elements
Dependencies are inferred from the claim text.