Thermal barrier for downhole flasked electronics

A method of investigating a borehole intersecting an earth formation, the method comprising:

• conveying a downhole tool in the borehole, the downhole tool having associated therewith an assembly configured to thermally isolate a thermally sensitive component, the assembly comprising:
• a thermal housing;
• at least one internal component inside the thermal housing, wherein the at least one internal component comprises the thermally sensitive component and a chassis;
• a thermal isolation support connecting the chassis to the downhole tool;
• wherein the thermal isolation support comprises an additive manufacturing structural framework, the framework including a plurality of connnected strucutral members, with a structural member of the plurality of defining at least one of (i) a channel through the structural member configured to permit flow of a fluid through the channel, and (ii) an electrical conductor provided by a portion of the strucutal member made up of electrically conductive material.

An apparatus for use in a borehole intersecting an earth formation, the apparatus comprising:

• an assembly associated with a downhole tool and configured to thermally isolate a thermally sensitive component, the assembly comprising:
• a thermal housing;
• at least one internal component inside the thermal housing, wherein the at least one internal component comprises the thermally sensitive component;
• a thermal isolation support connecting the at least one internal component to the downhole tool;
• wherein the thermal isolation support comprises an additive manufacturing structural framework connected to the downhole tool, the framework including a plurality of connected structural members, with a structural member of the plurality defining an electrical conductor provided by a portion of the structural member made up of electrically conductive material.