Method of forming circuit body and circuit body
AssigneeYazaki Corporation
InventorsKeita Shimakura, Takuo Matsumoto
Life of this patent
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Abstract
A conductive portion of a circuit body is formed by performing spraying on a surface of a resin casing. For spraying of the conductive portion, a cold spray method in which metal powder and inert gas are sprayed to an object is used. A circuit component is mounted on the conductive portion. Each terminal portion of the conductive portion is provided with a connector for connection with an external circuit body. An insulating resin is laminated on a surface of the conductive portion. The circuit body is directly formed on the surface of the resin casing by a series of processes described above.
Claims4
A circuit body, comprising:
- a resin casing;
- and
- a conductive portion which is formed on a surface of the resin casing, wherein
- the conductive portion has
- a first layer constituted of an aggregate of metal particles and embedded in the surface of the resin casing, and
- a second layer constituted of an aggregate of metal particles and laminated on the first layer,
- a density of the second layer is greater than that of the first layer, wherein
- the conductive portion in which a particle diameter of the metal particles is 5 μm or more and 50 μm or less is formed in the resin casing mounted on a vehicle,
- an insulating resin is laminated at least on the conductive portion, and
- a circuit component is mounted on the conductive portion,
- wherein the circuit component has
- a connector unit to which a wire connected to an auxiliary device is connected, and
- a control unit for controlling the auxiliary device.
Dependencies are inferred from the claim text.