Method for bonding substrate and substrate for display manufactured by the same

A method for bonding substrates, comprising:

• (a) printing a first photocurable adhesive ink on a lower substrate to form a pattern;
• (b) photocuring the pattern to form a spacer on the lower substrate;
• (c) printing a second photocurable adhesive ink on the lower substrate, which includes the spacer disposed thereon, to form an adhesive layer, wherein the first and second photocurable adhesive inks are the same or different;
• (d) irradiating the adhesive layer with light;
• and
• (e) laminating an upper substrate to the lower substrate via the irradiated adhesive layer to form bonded substrates comprising the upper substrate, the lower substrate, the adhesive layer, and the spacer, wherein the upper and lower substrates are spaced apart by the height of the spacer,
• wherein each of the upper and lower substrates is transparent or opaque, and wherein the upper and lower substrates comprise same or different materials.