MEMS device and manufacturing method thereof

A manufacturing method of a MEMS device, comprising:

• forming a CMOS circuit;
• and
• forming a MEMS module on the CMOS circuit which is coupling to the MEMS module and configured to drive the MEMS module, wherein,
• the step of forming the MEMS module comprises:
• forming a protective layer;
• forming a first contact hole and the second contact hole in the protective layer;
• forming a sacrificial layer in the protective layer;
• forming a first electrode on the protective layer and on the sacrificial layer so that the first electrode covers the sacrificial layer, and electrically coupling the first electrode to the CMOS circuit;
• forming a piezoelectric layer on the first electrode and above the sacrificial layer;
• forming a second electrode on the piezoelectric layer and electrically coupling the second electrode to the CMOS circuit;
• forming a through hole in the first electrode or in the protective layer to reach the sacrificial layer;
• and
• forming a cavity by removing the sacrificial layer through the through hole,
• wherein, the step of forming the CMOS circuit comprises:
• forming a plurality of second interconnecting holes in a second dielectric layer, and patterning a second wiring layer on the second dielectric layer to form a plurality of second interconnecting leads each of which has one end in one of the plurality of second interconnecting holes and the other end extending into the first contact hole and the second contact hole,
• the first electrode is electrically coupling to the CMOS circuit through the first contact hole, and the second electrode is electrically coupling to the CMOS circuit through the second contact hole.