De-contented fluid ejection

A system, comprising:

• a primer applying apparatus to apply a primer onto a plastic substrate moving along a substrate conveying path;
• at least one fluid ejection apparatus to dispense a de-contented fluid onto the plastic substrate moving along the substrate conveying path;
• a heater arranged after the at least one fluid ejection apparatus along the substrate conveying path, the heater to remove a liquid from the de-contented fluid on the plastic substrate such that particles of the de-contented fluid remain on the plastic substrate;
• an energy source arranged after the heater along the substrate conveying path, the energy source to apply energy to the plastic substrate during conveyance of the plastic substrate;
• and
• a processor to control the primer applying apparatus to apply the primer onto the plastic substrate, to control the at least one fluid ejection apparatus to dispense the de-contented fluid, to control the heater to heat the de-contented fluid to remove the liquid from the de-contented fluid, and to control the energy source to heat the plastic substrate to a temperature that is approximately a melting temperature of the plastic substrate to create imperfections near a top surface of the plastic substrate and allow particles that are melted to be imbibed by the imperfections to fuse the particles on the plastic substrate to the plastic substrate.

A method, comprising:

• controlling, via a processor, at least one fluid ejection apparatus to dispense a de-contented fluid on a plastic substrate during conveyance of the plastic substrate to print an image;
• controlling, via the processor, a heater arranged after the at least one fluid ejection apparatus along a substrate conveying path to heat the de-contented fluid to remove water from the de-contented fluid such that particles of the de-contented fluid remain on the plastic substrate;
• and
• controlling, via the processor, an energy source arranged after the heater along the substrate conveying path to apply energy from at least one light emitting diode (LED) to the plastic substrate during the conveyance of the plastic substrate to heat the plastic substrate to a temperature that is at approximately a melting temperature of the plastic substrate to create imperfections near a top surface of the plastic substrate and allow particles that are melted to be imbibed by the imperfections to fuse the particles on the plastic substrate to the plastic substrate.