Engineered floor board

An engineered floor board comprising a top wood sheet of wood glued to a surface of a flexible sheet of wood strips, said wood strips being elongated wood strips of rectangular cross-section held together in a side-by-side aligned spaced relationship by thermofusable glue droplets, the thermofusable glue droplets being spaced longitudinally apart from one another along flat, opposed side edges of said wood strips, all having the same width between said opposed side edges and collectively interconnecting said wood strips to one another between said opposed side edges in a manner providing a constant spacing between the wood strips, the thermofusable glue droplets all having the same width between said opposed side edges collectively forming a flexible joint providing flexibility to said flexible sheet of wood strips, the thermofusable glue droplets providing a mechanical retention force to retain the wood strips in an interconnected spaced-apart relationship, a gap being defined between interconnected opposed side edges, the gap having a constant width between said opposed side edges and being regularly intersected by said thermofusable glue droplets, said wood strips having a longitudinal axis thereof disposed transverse to a grain orientation axis of said top wood sheet to provide flexibility of said top wood sheet along said grain orientation axis and dimensional stability to said engineered floor board.