Ultrasonic additively manufactured coldplates on heat spreaders
AssigneeRaytheon Company
InventorsTravis L. Mayberry, Craig H. McCordic, Joseph R. Ellsworth
Life of this patent
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Abstract
A method of forming a cooling structure for a heat-dissipating surface includes arranging a heat spreader layer adjacent the heat-dissipating surface, bonding a coldplate directly to the heat spreader layer opposite the heat-dissipating surface, and forming an intermetallic bond between the heat spreader layer and the coldplate. The coldplate is bonded to the heat spreader layer using ultrasonic additive manufacturing.
Claims14
A method of forming a cooling structure for a heat-dissipating surface, the method comprising:
- building a heat spreader layer adjacent the heat-dissipating surface in a layer-by-layer process using ultrasonic additive manufacturing in a direction that is normal to the heat-dissipating surface, wherein the heat spreader layer is formed to have a plurality of sublayers;
- bonding a coldplate directly to the heat spreader layer opposite the heat-dissipating surface using ultrasonic additive manufacturing;
- forming an intermetallic bond between the heat spreader layer and the coldplate, wherein forming the intermetallic bond includes forming a metal-to-metal contact between dissimilar metal materials or multi-material laminates;
- forming the coldplate having serpentine cooling channels and building the coldplate over the heat spreader layer built in a layer-by-layer process using ultrasonic additive manufacturing in the direction that is normal to the heat-dissipating surface;
- and
- arranging finstock in the serpentine cooling channels of the coldplate,
- wherein the heat spreader layer is configured to spread heat prior to cooling with forced convection in the coldplate.
A cooling structure for a heat-dissipating surface, the cooling structure comprising:
- a heat spreader layer arranged adjacent the heat-dissipating surface, the heat spreader layer being built up adjacent the heat-dissipating surface in a layer-by-layer process using ultrasonic additive manufacturing in a direction that is normal to the heat-dissipating surface;
- and
- a coldplate that is bonded directly to the heat spreader layer opposite the heat-dissipating surface using ultrasonic additive manufacturing, wherein the heat spreader layer and the coldplate have an intermetallic bond that is formed of a metal-to-metal contact between dissimilar metal materials or multi-material laminates, the coldplate being built up over the heat spreader layer built in a layer-by-layer process using ultrasonic additive manufacturing in the direction that is normal to the heat-dissipating surface, the coldplate having serpentine cooling channels and finstock arranged in the serpentine cooling channels.
Dependencies are inferred from the claim text.