Monolithic neural interface system

A system comprising:

• a chip comprising:
• an integrated circuit (IC) being embedded in a frontplane layer and comprising a plurality of amplifiers configured to amplify received neural signals from a monitored subject, and a radio data signal generator configured to process the amplified neural signals and generate a multiplexed digital signal;
• radio-frequency (RF) planar coils embedded in a backplane layer and electrically connected to the IC, the RF planar coils being configured for wireless transmission of the multiplexed digital signal and being configured to receive wireless power signals to power the IC;
• and
• a plurality of on-chip electrodes integrated with the frontplane layer and configured to directly sense the neural signals of the subject and provide the neural signals to the plurality of amplifiers;
• and
• a prosthetic device having coupled thereto a computing device and an external power source and configured to be worn by the subject wherein the computing device receives the multiplexed digital signal and the external power source supplies the wireless power signals to the prosthetic device, wherein the prosthetic device comprises one or more actuators that are controlled based on the sensed neural signals from the plurality of on-chip electrodes;
• wherein the chip comprising the frontplane layer, the backplane layer and the plurality of on-chip electrodes form a wireless, battery-less monolithically-integrated neural interface (MINI) device configured to be implanted.

A method comprising:

• manufacturing a chip for a wireless, battery-less monolithically-integrated neural interface (MINI) device, the manufacturing the chip comprising:
• embedding an integrated circuit (IC) comprising a plurality of amplifiers configured to amplify received neural signals from a monitored subject in a frontplane layer;
• embedding a radio data signal generator configured to process the amplified neural signals and generate a multiplexed digital signal;
• and
• embedding a radio-frequency (RF) planar coils in a backplane layer, the RF planar coils being electrically connected to the IC and configured for wireless transmission of the multiplexed digital signal to a remote wireless device and being configured to receive wireless power signals to power the IC;
• and
• on-chip integrating a plurality of on-chip electrodes on the chip, the plurality of on-chip electrodes configured to directly sense the neural signals of the subject and provide the neural signals to the plurality of amplifiers, wherein on-chip integrating comprises forming one of a pillar electrode array or a planar electrode array, and wherein the plurality of on-chip electrodes comprises at least 1000 electrodes.