Systems and methods of additive printing of functional electronic circuits
AssigneeMorningbird Media Corporation
InventorChance M. Glenn
Life of this patent
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Abstract
A composition, method, and system for directly printing and creating complete functional 3D electronic circuits and devices without any thermal or laser post-processing treatment, by using at least Triphenylamine (TPA) as a powder binding agent. The composition can have mechanical characteristics that allow it to be melted and extruded on a structure, and electrical properties that allow it to function as at least one of a conductor, insulator, resistor, p-type semiconductor, n-type semiconductor, or capacitor.
Claims5
A composition for use in 3D printing of electronic devices, comprising:
- at least Triphenylamine (TPA), wherein
- the TPA is in powder form and is used as a powder binding agent in the composition, and
- the composition is to be melted and extruded on a structure,
- wherein:
- the composition is insulating, and
- the TPA forms about 99% of the composition by weight.
A composition for use in 3D printing of electronic devices, comprising:
- at least Triphenylamine (TPA), wherein
- the TPA is in powder form and is used as a powder binding agent in the composition, and
- the composition is to be melted and extruded on a structure,
- wherein:
- the composition is insulating,
- Polylactide (PLA) forms about 25% of the composition by weight, and
- the TPA forms about 75% of the composition by weight.
A composition for use in 3D printing of electronic devices, comprising:
- at least Triphenylamine (TPA), wherein
- the TPA is in powder form and is used as a powder binding agent in the composition, and
- the composition is to be melted and extruded on a structure,
- wherein:
- the composition is capacitive,
- PLA forms at least about 30% of the composition by weight, and Titanium dioxide (TiO2) forms at least about 35% of the composition by weight, and
- the TiO2 is in a powder form with particle size ranging from about 100 nm to about 100,000 nm.
A composition for use in 3D printing of electronic devices, comprising:
- at least Triphenylamine (TPA), wherein
- the TPA is in powder form and is used as a powder binding agent in the composition, and
- the composition is to be melted and extruded on a structure,
- wherein:
- the composition is semiconducting,
- silver (Ag) forms at least about 5% of the composition by weight, and n-type Silicon semiconductor (Si—N) forms at least about 50% of the composition by weight, and
- the Si—N is in a wafer form with a particle size of about 100 um.
A composition for use in 3D printing of electronic devices, comprising:
- at least Triphenylamine (TPA), wherein
- the TPA is in powder form and is used as a powder binding agent in the composition, and
- the composition is to be melted and extruded on a structure,
- wherein:
- the composition is semiconducting,
- silver (Ag) forms at least about 5% of the composition by weight, and p-type Silicon semiconductor (Si—P) forms at least about 50% of the composition by weight, and
- the Si—P is in a wafer form with a particle size of about 100 um.
Dependencies are inferred from the claim text.