Polyamide compositions and plating applications thereof

A polyamide composition consisting of:

• from 45 wt. % to 75 wt. % of a an polyamide , wherein the polyamide is PA-6,6/6, PA-6,6/6I, or PA-6,6/6I/6, or combinations thereof, and the polyamide comprises greater than 65 wt. % 6,6 units;
• greater than 2 wt. % and less than 18 wt. % of a silane-coated magnesium hydroxide;
• from 10 wt. % to 40 wt. % of kaolin;
• and
• from 0.1 wt. % to 13 wt. % of additive,
• wherein the composition has a distinctness of image of at least 85 as measured by Byk Gardner Wave Scan meter and a tensile strength of at least 63 MPa as measured by ASTM D638;
• and
• wherein the additive comprises inorganic stabilizers, organic stabilizers, lubricants, dyes, pigments, nucleating agents, metal flakes, impact modifiers, antistatic agents, conductivity additives, mold-release agents, optical brighteners, adhesion promoters, ageing inhibitors, antioxidants, antiozonants, light stabilizers, UV stabilizers, UV absorbers, UV blockers, inorganic heat stabilizers, organic heat stabilizers, processing aids, crystallization accelerators, crystallization retarders, and flow aids, wherein the composition does not comprise any glass fibers.