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US 11,299,620 B2Granted
Epoxy resin composition, cured product, and electrical or electronic component
AssigneeMitsubishi Chemical Corporation
InventorKazumasa Oota
Life of this patent
Estimating the term…
Abstract
The present invention relates to an epoxy resin composition (A) containing an epoxy resin represented by the following formula (1): and an epoxy resin represented by the following formula (2): wherein in formula (2), n represents an integer of from 0 to 2, wherein a content of the epoxy resin represented by formula (1) is from 0.01 to 0.99% by weight, and relates to an epoxy resin composition (B) containing a curing agent in an amount of from 0.01 to 1000 parts by weight relative to 100 parts by weight of the epoxy resin composition (A).
Claims17
An epoxy resin composition (A), comprising
- an epoxy resin represented by the following formula (1):
- and
- an epoxy resin represented by the following formula (2):
- wherein in formula (2), n represents an integer of from 0 to 2,
- wherein a content of the epoxy resin represented by formula (1) is from 0.01 to 0.99% by weight.
2 more elements
Dependencies are inferred from the claim text.