Polyamide resin composition

A polyamide resin composition comprising (A) a polyamide resin and (B) an inorganic filler, wherein:

• the (A) polyamide resin comprises polyamide 66 in an amount of 90 mass or more relative to 100 mass % of the polyamide resin and a liquidity improver in an amount of from 0.1 to 10 mass % relative to 100 mass % of the polyamide resin;
• the (B) inorganic filler is contained in an amount of 30 mass % or more relative to 100 mass % of the polyamide resin composition;
• the polyamide resin composition has a solidifying point of 210° C. or more;
• the polyamide resin composition has a spiral flow value in a flat spiral mold having a cavity width of 10 mm and a thickness of 2 mm, the spiral flow value being 60 cm or more under the conditions of a set temperature of 285° C., a mold temperature of 80° C., and an injection pressure of 70 MPa when the content of the (B) inorganic filler is 30 mass % or more and less than 40 mass %, being 40 cm or more under the conditions of a set temperature of 285° C., a mold temperature of 80° C., and an injection pressure of 70 MPa when the content of the (B) inorganic filler is 40 mass % or more and not greater than 50 mass %, and being 20 cm or more under the conditions of a set temperature 295° C., a mold temperature of 80° C., and an injection pressure of 70 MPa when the content of the (B) inorganic filler is greater than 50 mass % and not greater than 70 mass %;
• the polyamide resin composition has a strain of 3.8% or less measured in a 1000-hour tensile creep test under the conditions of 120° C. and 60 MPa, and
• the polyamide resin composition has a formic acid relative viscosity VR in the range of 30<VR<40.