US 11,299,448 B2Granted

Active ester compound

AssigneeDIC Corporation

InventorsTatsuya Okamoto, Yutaka Satou

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Abstract

An active ester compound that can form a cured product having excellent dielectric properties and copper foil adhesion properties is provided, a curable composition including the active ester compound is provided, and a cured product of the curable composition is provided. Also provided are a semiconductor encapsulating material, a printed wiring board, and a build-up film formed by using the curable composition. Specifically, an active ester compound is provided which includes a fluorinated hydrocarbon structural moiety and a plurality of aromatic ester structural moieties in the structure of the molecule and includes an aryloxycarbonyl structure or an arylcarbonyloxy structure at an end of the molecule, a curable composition including the active ester compound, and a cured product of the curable composition, and also provided are a semiconductor encapsulation material, a printed wiring board, and a build-up film formed by using the curable composition.

Claims9

Dependent claims

An active ester compound comprising:

a fluorinated hydrocarbon structural moiety (F) and a plurality of aromatic ester structural moieties (E) in a structure of a molecule;
and
an aryloxycarbonyl structure (P) or an arylcarbonyloxy structure (A) at an end of the molecule,
wherein the active ester compound is an esterification product of a compound (a1), a compound (a2), and a compound (a3), and at least one of the compound (a1), the compound (a2), and the compound (a3) contains the fluorinated hydrocarbon structural moiety (F) in a structure of a molecule, the compound (a1) being an aromatic monohydroxy compound, the compound (a2) being an aromatic polycarboxylic acid or an acid halide thereof (a2), the compound (a3) being a compound containing at least two phenolic hydroxyl groups in a structure of a molecule;
and
the ratio between the number of moles of the hydroxyl groups present in the aromatic monohydroxy compound (a1) and the number of moles of the hydroxyl groups present in the compound containing two or more phenolic hydroxyl groups in the structure of the molecule (a3) is 10:90 to 75:25.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 16/610,582Filed 10 Apr 2018
Priority: JP JP2017-09562612 May 2017
Published: US 2020/0148618 A114 May 2020
Granted: 12 Apr 2022
Term ends: Not estimatedThe source records don’t support an estimate.

Classification21 codes

C07C 65/21
Compounds having carboxyl groups bound to carbon atoms of six—membered aromatic rings and containing any of the groups OH, O—metal, —CHO, keto,…:…
H10W 74/47
Characterised by their materials: comprising organic materials, e.g. plastics or resins
C07C 67/03
Preparation of carboxylic acid esters: by reacting an ester group with a hydroxy group
C07C 69/78
Esters of carboxylic acids having a carboxyl group bound to a carbon atom of a six-membered aromatic ring: benzoic acid esters

Family

US 2020/0148618 A1Pre-grant publication · published 14 May 2020
US 11,299,448 B2This patent

From the US filing history. Foreign family members aren’t listed.

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