Packaging for MEMS transducers

A MEMS transducer package comprising:

• a substrate forming a package substrate of the MEMS transducer package, the substrate comprising:
• a conductive layer which defines upper and lower surfaces of the substrate;
• a conductive portion which is electrically isolated from the conductive layer, wherein the conductive portion is supported between a first plane defined by the upper surface of the substrate and a second plane defined by the lower surface of the substrate by an electrically insulating moulding substance;
• an intermediate substrate provided on the first planar surface of the package substrate, the intermediate substrate comprising an aperture and being arranged relative to the package substrate so as to overly a hole which extends through the package substrate from the upper planar surface to the lower planar surface thereof;
• a MEMS transducer provided on the upper surface of the intermediate substrate;
• electronic circuitry provided on the upper surface of the intermediate substrate;
• and
• a conductive lid structure, wherein the lid structure is mounted to the upper surface of the substrate to define an interior chamber.