Integrated semiconductor die parceling platforms

An integrated semiconductor die parceling platform comprising:

• an inspection station configured to receive a die vessel, wherein the inspection station is configured to inspect the die vessel for defects utilizing an image sensor arranged over part of a conveyor system;
• a desiccant station configured to receive the die vessel from the inspection station, wherein the desiccant station comprises at least one desiccant loader that is configured to add a desiccant to the die vessel;
• a bundle station configured to receive the die vessel from the desiccant station, wherein the bundle station comprises a plurality of die vessels stacked on top of one another and configured to be secured together via a harness;
• a bagging station configured to receive the die bundle from the bundle station, wherein the bagging station is configured to dispose the die bundle in a die bag and to heat seal the die bag with the die bundle inside, wherein the bagging station comprises a suction conduit configured to remove a gas from the die bag;
• and
• a folding station configured to receive the die bag from the bagging station, wherein the folding station comprises a robotic arm configured to fold the die bag and deposit the folded die bag onto one of a plurality of shelves of an outport car, wherein the outport car transports the folded die bag from the integrated semiconductor die parceling platform,
• wherein each station is a stationary point for processing the one or more die vessels.

An outport car processing manipulator system of a die parceling platform, the system comprising:

• a folding station configured to receive one or more die bags from a bagging station via a conveyer system, wherein the folding station comprises at least one robotic arm configured to:
• fold each of the one or more die bags to reduce a size of the die bag in order that the die bag fits one of a number of respective shelves of an outport car;
• and
• place each of the one or more folded die bags onto the one of the number of the respective shelves of the outport car,
• wherein the outport car transports the one or more folded die bags from the die parceling platform.