Method for double-side polishing wafer

A method for double-side polishing a wafer, comprising:

• double-side polishing a carrier, using a second double-side polishing machine, without a wafer disposed in the carrier, the double-side polishing of the carrier including two-stage double-side polishing which includes primary polishing using slurry containing abrasive grains and secondary polishing using an inorganic alkali solution containing no abrasive grain;
• after the double-side polishing of the carrier, arranging the carrier between upper and lower turntables having polishing pads attached thereto respectively in a first double-side polishing machine different from the second double-side polishing machine;
• holding the wafer in a holding hole formed in the carrier to be sandwiched between the upper and lower turntables;
• and
• double-side polishing the wafer using the first double-side polishing machine,
• wherein a plurality of batches of the double-side polishing the wafer using the first double-side polishing machine are performed, and the double-side polishing including the two-stage double-side polishing using the second double-side polishing machine is performed for each of the plurality of batches.