Template that improves solder-paste stenciling and production method thereof
AssigneeInterlatin S De Rl De Cv
InventorsJimmy Villalvazo, Nestor Librado Castro Leyva
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AssigneeInterlatin S De Rl De Cv
InventorsJimmy Villalvazo, Nestor Librado Castro Leyva
Estimating the term…
A template or stencil with perforations, which improves solder-paste stencilling on an object, includes: a first area treated with precision powder on a bottom laminar face of the template, the treated face covering at least an area where perforations are distributed; a second area treated with precision powder on a top laminar surface of the template, the second treated area encircling the perforations; and a third area treated twice with precision powder on the bottom laminar surface, the third area encircling the perforations of the template. A method for producing a template that improves solder-paste stencilling on an object is also provided, as is and to a method for the improved application of solder-paste on an object, such as a printed circuit board.
A template which improves the solder-paste stencilling in an object, comprising a top laminar face, a bottom laminar face, and one or more perforations, the template further comprising:
A method for manufacturing a template that improves solder-paste stencilling, comprising:
Dependencies are inferred from the claim text.