Cooling apparatus and plasma-cleaning station for cooling apparatus

A lithographic apparatus comprising:

• a projection apparatus configured to project a radiation beam to form an exposure area on a substrate;
• and
• a cooling system comprising:
• a cooling apparatus located, in use, above the substrate adjacent to the exposure area, the cooling apparatus comprising a cooling surface and an outlet, the cooling surface being configured to remove heat from the substrate during use, the outlet being configured to deliver a cooling fluid, and the cooling surface and the outlet are configured to face the substrate during use;
• and
• a contamination control arrangement configured to control or remove contamination of a surface of the cooling apparatus.

A cooling system for use in a projection apparatus, the projection apparatus being configured to project a radiation beam to form an exposure area on a substrate, the cooling system comprising:

• a cooling apparatus located, in use, above the substrate adjacent to the exposure area, the cooling apparatus being configured to remove heat from the substrate during use;
• and
• a contamination control arrangement configured to control or remove contamination of a surface of the cooling apparatus, wherein the contamination control arrangement comprises:
• a gas supply for supplying gas to an area above the substrate;
• and
• an aperture for receipt of the radiation beam wherein in use supplied gas and a received radiation beam react to form a plasma in the area above the substrate;
• wherein the cooling apparatus has at least one surface comprising a material selected to increase a radical recombination probability.