Substrate transport vacuum platform

An apparatus comprising:

• a device comprising a robot arm connected to a robot drive, where the robot arm comprises an end effector configured to support at least one substrate thereon;
• and
• a transport having the device connected thereto, where the transport is configured to carry the device, where the transport comprises:
• a first support comprising a first capacitive interface;
• and
• a second support comprising a second capacitive interface,
• where the second support is movably connected relative to the first support along a linear path, and where the first and second capacitive interfaces are sized, shaped and located relative to each other to provide a non-contacting capacitive power coupling, and where the first and second capacitive interfaces are sized, shaped and located relative to each other to provide a heat transfer interface between the first and second capacitive interfaces.

An apparatus comprising:

• a device configured to support at least one substrate thereon;
• and
• a transport having the device connected thereto, where the transport is configured to carry the device, where the transport comprises:
• a first support comprising a first capacitive interface;
• and
• a second support comprising a second capacitive interface,
• where the second support is movably connected relative to the first support along a linear path, where the first and second capacitive interfaces are sized, shaped and located relative to each other to provide a non-contacting capacitive power coupling and to allow heat transfer between the first and second capacitive interfaces, and where the capacitive interfaces comprise interleaved opposing surfaces configured to transfer heat to one another by radiation and convection.

A substrate transport apparatus comprising:

• a chamber;
• and
• a movable enclosure forming an enclosed environment, where the movable enclosure is movably located inside the chamber,
• where the apparatus further comprises:
• a device comprising a robot arm connected to a robot drive, where the robot arm comprises an end effector configured to support at least one substrate thereon, where at least a portion of the device is located inside the enclosed environment of the movable enclosure;
• and
• a transport configured to move the movable enclosure in the chamber, where the transport comprises:
• a first support comprising a first capacitive interface;
• and
• a second support comprising a second capacitive interface,
• where the second support is movably connected relative to the first support along a linear path, and where the first and second capacitive interfaces are sized, shaped and located relative to each other to provide a non-contacting capacitive power coupling,
• where the second support is stationarily connected to a portion of the movable enclosure.

An apparatus comprising:

• a device comprising a shuttle, where the device comprises a portion configured to removably support at least one substrate thereon for transporting the substrate along a path of the shuttle;
• and
• a transport having the device connected thereto, where the transport is configured to move the device and the at least one substrate on the portion of the device between at least two locations, where the transport comprises:
• a first support comprising a first capacitive interface;
• and
• a second support comprising a second capacitive interface, where the second support is connected to the device,
• where the second support is movably connected relative to the first support along a linear path, and where the first and second capacitive interfaces are sized, shaped and located relative to each other to provide a non-contacting capacitive power coupling and to allow heat transfer between the first and second capacitive interfaces.