Method for treating substrate involving supplying treatment liquid to peripheral area of substrate by second nozzle

A method for treating a substrate, wherein the substrate is treated by supplying a treatment liquid onto the rotating substrate by using a first nozzle and a second nozzle,

• wherein the first nozzle supplies the treatment liquid to an area including a central area on the substrate, and
• wherein the second nozzle supplies the treatment liquid to a peripheral area of the substrate,
• the method comprising a first supply operation of supplying the treatment liquid onto the substrate by using the first nozzle and supplying the treatment liquid to the peripheral area by using the second nozzle at the same time;
• and
• thereafter, a second supply operation of supplying the treatment liquid by using the first nozzle and stopping supply of the treatment liquid by using the second nozzle;
• wherein in the first supply operation, the first nozzle supplies the treatment liquid while moving a first supply point that is a supply point of the treatment liquid supplied from the first nozzle on the substrate,
• wherein in the first supply operation, the second nozzle supplies the treatment liquid while a second supply point that is a supply point of the treatment liquid supplied from the second nozzle on the substrate moves only between a second location and a third location of the peripheral area,
• wherein the second location is a location that is closer to the central area of the substrate than the third location,
• wherein in the first supply operation, the first nozzle supplies the treatment liquid while the first supply point moves between the central area and the peripheral area of the substrate, and
• wherein in the second supply operation, immediately after the first supply operation is performed, the first nozzle supplies the treatment liquid while the first supply point moves from a first location of the peripheral area to an end of the substrate.