Power module having metallic heat-dissipation substrate

A power module comprising:

• a power converter having an input pin and an output pin and comprising at least one heat-generating component and a printed circuit board, wherein the input pin and the output pin of the power converter are soldered on and electrically connected with a system board, the printed circuit board of the power converter has a first surface, a first penetration hole, and a second surface, and the at least one heat-generating component is disposed on the second surface of the printed circuit board;
• and
• a metallic heat-dissipation substrate having a first surface and a second surface opposite to each other, and a second penetration hole, wherein the first surface of the metallic heat-dissipation substrate has at least one fixing position and at least one heat-dissipating position, the fixing position of the first surface of the metallic heat-dissipation substrate is connected with the second surface of the printed circuit board, a gap accumulated by tolerances is formed between the heat-dissipating position and the heat-generating component, a gap-filling material is filled into the gap, and the second surface of the metallic heat-dissipation substrate and the system board are soldered with each other,
• wherein the first penetration hole and the second penetration hole are aligned to form a penetration hole set, wherein the penetration hole set is penetrated by a screw rod to fasten the printed circuit board and the metallic heat-dissipation substrate.