Raised pathway heat sink

A device comprising:

• a housing including an upper cover and a lower cover, wherein said upper cover and said lower cover are configured to be secured together;
• and
• a heat sink having a main surface configured to be housed within the housing,
• wherein the main surface of the heat sink defines one or more raised covered pathways that include at least one antenna cable therethrough, wherein the one or more raised covered pathways extend upward in a direction toward the upper cover of the housing and,
• wherein upon securing the heat sink to the lower cover of the housing, the one or more raised covered pathways form one or more tunnels between the heat sink and the housing.

A wireless electronic device comprising:

• a housing formed of an upper cover and a lower cover, wherein said upper cover and said lower cover and configured to be secured together;
• a printed circuit board with a plurality of components mounted thereto including at least one integrated circuit;
• at least one wireless antenna, wherein the at least one wireless antenna includes at least one antenna cable;
• and
• a heat sink having a main surface configured to be secured proximate to an inner surface of the lower cover of the housing, wherein the main surface of the heat sink defines one or more raised covered pathways therein that are dimensioned to house the at least one antenna cable therethrough, and wherein the one or more raised covered pathways extend upward in a direction toward the upper cover of the housing,
• wherein upon securing the heat sink to the lower cover of the housing, the one or more raised covered pathways form one or more tunnels between the heat sink and the housing, and wherein the one or more tunnels route the at least one antenna cable.