Heat transfer apparatus
AssigneeNokia Technologies Oy
InventorNicholas Jeffers
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AssigneeNokia Technologies Oy
InventorNicholas Jeffers
Estimating the term…
A heat transfer apparatus and method of manufacture is disclosed. The manifold may have a first mechanical interface, a second mechanical interface remote from the first mechanical interface and one or more internal walls defining at least first and second channels within the manifold between the first and second mechanical interfaces. An evaporator member may be attached to the manifold so as to seal the first mechanical interface. A condenser member may be attached to the manifold so as to seal the second mechanical interface. The manifold, evaporator and condenser members may provide a contained heat transfer system in which a working fluid moves between the condenser member and the evaporator member.
An apparatus comprising:
A method comprising:
Dependencies are inferred from the claim text.