Method of fabricating an electronic medical device, including overmolding an assembly with thermoplastic material

A method of fabricating an electronic medical device, the method comprising:

• providing a printed circuit board assembly comprising a printed circuit board, electronic components mounted to the printed circuit board, and a battery mounted to the printed circuit board;
• placing the printed circuit board assembly into a first mold that allows a hotmelt material to be introduced around sections of the printed circuit board assembly to be encapsulated, wherein the printed circuit board assembly comprises a plurality of protruding sections extending from the printed circuit board to support the printed circuit board in the first mold;
• introducing the hotmelt material into the first mold to overmold the printed circuit board assembly with the hotmelt material and form a protective inner shell to obtain a protected circuit board assembly, wherein the protective inner shell encases the electronic components and the battery, and wherein, after introducing the hotmelt material into the first mold, at least a portion of each protruding section of the plurality of protruding sections protrudes from the protected circuit board assembly;
• placing the protected circuit board assembly into a second mold that allows a thermoplastic elastomer material or a thermoplastic polyurethane material to be introduced around sections of the protected circuit board assembly to be encased;
• introducing the thermoplastic elastomer material or the thermoplastic polyurethane material into the second mold to overmold the protected circuit board assembly with the thermoplastic elastomer material or the thermoplastic polyurethane material to form a first section of an outer shell surrounding at least a portion of the protected circuit board assembly, wherein the protective inner shell protects the electronic components and the battery against heat and pressure associated with overmolding the protected circuit board assembly with the thermoplastic elastomer material or the thermoplastic polyurethane material, wherein, after overmolding to form the first section of the outer shell, the protected circuit board assembly and the first section of the outer shell define a void where the second mold supported the protected circuit board assembly;
• and
• overmolding the void to form a second section of the outer shell.